In this year full of hope and challenges, Zhejiang Aike Semiconductor Equipment Co., Ltd., together with every colleague, has forged ahead in the semiconductor industry with fearless courage and unremitting efforts. In order to celebrate our achievements and look forward to a brighter future, we ushered in the long-awaited annual event.

In the preparation process of semiconductor materials, each process involves cleaning, and the quality of cleaning directly affects the next process, and even affects the yield and reliability of the device. Due to the rapid improvement of ULSI integration and the reduction of device size, the requirements for wafer surface contamination are more stringent. The ULSI process requires no more than 500 adsorbents/m2×0.12um on the provided substrate, and metal contamination is less than 1010atom /cm2. Potential contamination at every step in wafer production can lead to defects and device failure. Therefore, the cleaning of silicon wafers has attracted the attention of professionals. In the past, many manufacturers used hand-washing method. This method has many artificial factors. On the one hand, it is easy to generate debris and reduce economic benefits. On the other hand, the surface cleanliness of hand-washed silicon wafers is poor and the pollution is serious, which makes the next process corrosion The pass rate in the process is low. Therefore, the cleaning technology of silicon wafers has attracted people's attention, and it is imperative to find a simple and effective cleaning method. Professionally introduced an ultrasonic cleaning technology, which has a remarkable effect on cleaning silicon wafers, and is a silicon wafer cleaning technology worthy of promotion.

In the preparation process of semiconductor materials, each process involves cleaning, and the quality of cleaning directly affects the next process, and even affects the yield and reliability of the device. Due to the rapid improvement of ULSI integration and the reduction of device size, the requirements for wafer surface contamination are more stringent. The ULSI process requires no more than 500 adsorbents/m2×0.12um on the provided substrate, and metal contamination is less than 1010atom /cm2. Potential contamination at every step in wafer production can lead to defects and device failure. Therefore, the cleaning of silicon wafers has attracted the attention of professionals. In the past, many manufacturers used hand-washing method. This method has many artificial factors. On the one hand, it is easy to generate debris and reduce economic benefits. On the other hand, the surface cleanliness of hand-washed silicon wafers is poor and the pollution is serious, which makes the next process corrosion The pass rate in the process is low. Therefore, the cleaning technology of silicon wafers has attracted people's attention, and it is imperative to find a simple and effective cleaning method. Professionally introduced an ultrasonic cleaning technology, which has a remarkable effect on cleaning silicon wafers, and is a silicon wafer cleaning technology worthy of promotion.

In the preparation process of semiconductor materials, each process involves cleaning, and the quality of cleaning directly affects the next process, and even affects the yield and reliability of the device. Due to the rapid improvement of ULSI integration and the reduction of device size, the requirements for wafer surface contamination are more stringent. The ULSI process requires no more than 500 adsorbents/m2×0.12um on the provided substrate, and metal contamination is less than 1010atom /cm2. Potential contamination at every step in wafer production can lead to defects and device failure. Therefore, the cleaning of silicon wafers has attracted the attention of professionals. In the past, many manufacturers used hand-washing method. This method has many artificial factors. On the one hand, it is easy to generate debris and reduce economic benefits. On the other hand, the surface cleanliness of hand-washed silicon wafers is poor and the pollution is serious, which makes the next process corrosion The pass rate in the process is low. Therefore, the cleaning technology of silicon wafers has attracted people's attention, and it is imperative to find a simple and effective cleaning method. Professionally introduced an ultrasonic cleaning technology, which has a remarkable effect on cleaning silicon wafers, and is a silicon wafer cleaning technology worthy of promotion.

In the preparation process of semiconductor materials, each process involves cleaning, and the quality of cleaning directly affects the next process, and even affects the yield and reliability of the device. Due to the rapid improvement of ULSI integration and the reduction of device size, the requirements for wafer surface contamination are more stringent. The ULSI process requires no more than 500 adsorbents/m2×0.12um on the provided substrate, and metal contamination is less than 1010atom /cm2. Potential contamination at every step in wafer production can lead to defects and device failure. Therefore, the cleaning of silicon wafers has attracted the attention of professionals. In the past, many manufacturers used hand-washing method. This method has many artificial factors. On the one hand, it is easy to generate debris and reduce economic benefits. On the other hand, the surface cleanliness of hand-washed silicon wafers is poor and the pollution is serious, which makes the next process corrosion The pass rate in the process is low. Therefore, the cleaning technology of silicon wafers has attracted people's attention, and it is imperative to find a simple and effective cleaning method. Professionally introduced an ultrasonic cleaning technology, which has a remarkable effect on cleaning silicon wafers, and is a silicon wafer cleaning technology worthy of promotion.