In the preparation process of semiconductor materials, each process involves cleaning, and the quality of cleaning directly affects the next process, and even affects the yield and reliability of the device. Due to the rapid improvement of ULSI integration and the reduction of device size, the requirements for wafer surface contamination are more stringent. The ULSI process requires no more than 500 adsorbents/m2×0.12um on the provided substrate, and metal contamination is less than 1010atom /cm2. Potential contamination at every step in wafer production can lead to defects and device failure. Therefore, the cleaning of silicon wafers has attracted the attention of professionals. In the past, many manufacturers used hand-washing method. This method has many artificial factors. On the one hand, it is easy to generate debris and reduce economic benefits. On the other hand, the surface cleanliness of hand-washed silicon wafers is poor and the pollution is serious, which makes the next process corrosion The pass rate in the process is low. Therefore, the cleaning technology of silicon wafers has attracted people's attention, and it is imperative to find a simple and effective cleaning method. Professionally introduced an ultrasonic cleaning technology, which has a remarkable effect on cleaning silicon wafers, and is a silicon wafer cleaning technology worthy of promotion.

The semiconductor industry is obviously cyclical. In 2019, the semiconductor market was at a low level. Coupled with the impact of the trade war, the price reduction of memory chips also made Samsung lose its first position in the semiconductor industry. However, the chairman of Macronix Taiwan expects a strong market recovery in 2020. He also pointed out that even if China invests a lot of capital to develop the semiconductor industry, it will take at least 20 years to cultivate talents and accumulate technology.

Compared with 2017, China's pure-play foundry market share increased by 5% in 2018, accounting for 19%, 5 percentage points higher than other countries in the Asia-Pacific region. Overall, the growth of the pure-play foundry market in 2018 basically came from China. However, in 2019, the U.S.-China trade war slowed China's economic growth, and China's foundry market share only increased by one percentage point in 2019, reaching 20%. In 2018, pure-play foundry sales in China rose 42% to $10.7 billion, more than eight times the 5% increase in pure-play foundry market sales that year. Additionally, in 2019, pure-play foundry sales to China increased by 6%, 8 percentage points higher than the overall pure-play foundry market of -2%. In 2019, Taiwan-based pure-play foundry company TSMC said that about 25% of its more than 400 customers are located in mainland China. Both TSMC and UMC achieved double-digit sales growth in China last year. UMC's sales in China rose the most, at 19%. Its growth is fueled by its 300mm Fab 12X fab in Xiamen, China, which opened in late 2016 and currently has a capacity of about 22.7K/month 300mm wafers. By contrast, many of SMIC's Chinese clients appear to be experiencing slow business growth. SMIC's sales in China fell 8% in 2019, while total sales fell 7%.

In the preparation process of semiconductor materials, each process involves cleaning, and the quality of cleaning directly affects the next process, and even affects the yield and reliability of the device. Due to the rapid improvement of ULSI integration and the reduction of device size, the requirements for wafer surface contamination are more stringent. The ULSI process requires no more than 500 adsorbents/m2×0.12um on the provided substrate, and metal contamination is less than 1010atom /cm2. Potential contamination at every step in wafer production can lead to defects and device failure. Therefore, the cleaning of silicon wafers has attracted the attention of professionals. In the past, many manufacturers used hand-washing method. This method has many artificial factors. On the one hand, it is easy to generate debris and reduce economic benefits. On the other hand, the surface cleanliness of hand-washed silicon wafers is poor and the pollution is serious, which makes the next process corrosion The pass rate in the process is low. Therefore, the cleaning technology of silicon wafers has attracted people's attention, and it is imperative to find a simple and effective cleaning method. Professionally introduced an ultrasonic cleaning technology, which has a remarkable effect on cleaning silicon wafers, and is a silicon wafer cleaning technology worthy of promotion.

The semiconductor industry is obviously cyclical. In 2019, the semiconductor market was at a low level. Coupled with the impact of the trade war, the price reduction of memory chips also made Samsung lose its first position in the semiconductor industry. However, the chairman of Macronix Taiwan expects a strong market recovery in 2020. He also pointed out that even if China invests a lot of capital to develop the semiconductor industry, it will take at least 20 years to cultivate talents and accumulate technology.

Compared with 2017, China's pure-play foundry market share increased by 5% in 2018, accounting for 19%, 5 percentage points higher than other countries in the Asia-Pacific region. Overall, the growth of the pure-play foundry market in 2018 basically came from China. However, in 2019, the U.S.-China trade war slowed China's economic growth, and China's foundry market share only increased by one percentage point in 2019, reaching 20%. In 2018, pure-play foundry sales in China rose 42% to $10.7 billion, more than eight times the 5% increase in pure-play foundry market sales that year. Additionally, in 2019, pure-play foundry sales to China increased by 6%, 8 percentage points higher than the overall pure-play foundry market of -2%. In 2019, Taiwan-based pure-play foundry company TSMC said that about 25% of its more than 400 customers are located in mainland China. Both TSMC and UMC achieved double-digit sales growth in China last year. UMC's sales in China rose the most, at 19%. Its growth is fueled by its 300mm Fab 12X fab in Xiamen, China, which opened in late 2016 and currently has a capacity of about 22.7K/month 300mm wafers. By contrast, many of SMIC's Chinese clients appear to be experiencing slow business growth. SMIC's sales in China fell 8% in 2019, while total sales fell 7%.

In the preparation process of semiconductor materials, each process involves cleaning, and the quality of cleaning directly affects the next process, and even affects the yield and reliability of the device. Due to the rapid improvement of ULSI integration and the reduction of device size, the requirements for wafer surface contamination are more stringent. The ULSI process requires no more than 500 adsorbents/m2×0.12um on the provided substrate, and metal contamination is less than 1010atom /cm2. Potential contamination at every step in wafer production can lead to defects and device failure. Therefore, the cleaning of silicon wafers has attracted the attention of professionals. In the past, many manufacturers used hand-washing method. This method has many artificial factors. On the one hand, it is easy to generate debris and reduce economic benefits. On the other hand, the surface cleanliness of hand-washed silicon wafers is poor and the pollution is serious, which makes the next process corrosion The pass rate in the process is low. Therefore, the cleaning technology of silicon wafers has attracted people's attention, and it is imperative to find a simple and effective cleaning method. Professionally introduced an ultrasonic cleaning technology, which has a remarkable effect on cleaning silicon wafers, and is a silicon wafer cleaning technology worthy of promotion.

In the preparation process of semiconductor materials, each process involves cleaning, and the quality of cleaning directly affects the next process, and even affects the yield and reliability of the device. Due to the rapid improvement of ULSI integration and the reduction of device size, the requirements for wafer surface contamination are more stringent. The ULSI process requires no more than 500 adsorbents/m2×0.12um on the provided substrate, and metal contamination is less than 1010atom /cm2. Potential contamination at every step in wafer production can lead to defects and device failure. Therefore, the cleaning of silicon wafers has attracted the attention of professionals. In the past, many manufacturers used hand-washing method. This method has many artificial factors. On the one hand, it is easy to generate debris and reduce economic benefits. On the other hand, the surface cleanliness of hand-washed silicon wafers is poor and the pollution is serious, which makes the next process corrosion The pass rate in the process is low. Therefore, the cleaning technology of silicon wafers has attracted people's attention, and it is imperative to find a simple and effective cleaning method. Professionally introduced an ultrasonic cleaning technology, which has a remarkable effect on cleaning silicon wafers, and is a silicon wafer cleaning technology worthy of promotion.