×
搜索查询
PROCUTS CENTER
产品中心
Used for the cleaning of silicon wafers before chamfering after LAPPING, to remove large particles, slurry, etc. left in the preamble. According to customer needs, the process flow is customized to achieve the expected cleanliness.
POST LAPPING CLEANER（ PLC）
Used for cleaning silicon wafers after peeling and before chamfering, to remove large particles, organic matter, etc. left behind by the previous process, and to customize the process flow according to customer needs to achieve the expected cleanliness.
Wire cutting post cleaning machine (PSC)
It is used for cleaning after edge polishing to remove particles, organics and metals brought by polishing. According to customer needs, the process flow can be customized to achieve the expected cleanliness.
Edge Polishing Cleaner（EPC）
Used for the etching of silicon wafers after Lapping, uniform and controllable etching of the surface of the silicon wafers with acid and lye has improved its TTV performance. According to customer needs, it can also have a certain cleaning function.
Hybrid Etcher
It is used for the cleaning of silicon wafers before annealing to remove particles and organic matters left by the preamble. According to customer needs, the process flow can be customized to achieve the expected cleanliness.
Furnace Cleaner（HTC）
It is used for the cleaning of silicon wafers to remove wax, and to remove the wax layer on the polishing back of silicon wafers to meet the process requirements.
De-Wax Cleaner
It is used for the cleaning of silicon wafers before the final shipment, and the tank process flow is customized according to customer needs to meet conditions such as metal, particles, and output.
Final Cleaner
It is used for cleaning after double-sided polishing to remove particles, organics and metals brought by double-sided polishing to prepare for the final cleaning. According to customer needs, the process flow can be customized to achieve the expected cleanliness.
Double Side Polishing Cleaner（DSPC）
Used for the etching of silicon wafers after Lapping, uniform and controllable corrosion of the silicon wafer surface with lye has improved its TTV performance. According to customer needs, it can also have a certain cleaning function.
Alkali Etcher
Product categories
CONTACT US
Number of views:
1000
Double Side Polishing Cleaner（DSPC）
Retail price
0.0
元
Market price
0.0
元
Number of views:
1000
Product serial number
Quantity
-
+
Stock:
0
Product description
Parameters
Product Specifications:
1. Scope of application: 12 inch silicon wafer
2. Process flow: tank-type batch cleaning, customized by customers;
3. Capacity: According to the technological process;
4. Handling method: cassette less;
5. Main function tank: SC-1; HF/HCL; O3; QDR; LIFT Dry, etc.;
6. Loading and unloading: Wet Cart in Foup out, which can correspond to OHT;
7. Equipment communication: SECS/GEM;
Previous
None
Next
None
Related Products
Product inquiry
客户留言
Description:
Leave us a message
页脚留言
Description:
Service Hotline
Tel：0573-80709601
Fax：0573-80701270
Address: No. 129, Shuanglian Road, Haining Economic Development Zone, Haining City, Jiaxing City, Zhejiang Province
Copyright © Zhejiang Echo Semiconductor Equipment Co., Ltd. 浙ICP备2021028978号-1
Copyright ©Zhejiang Echo Semiconductor Equipment Co., Ltd.
×
-
-
-