NEWS

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2021-09

LG

LG

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2021-09

Hynix

Hynix

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2021-09

AST

AST

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2021-09

GCL

GCL

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2021-08

On Ultrasonic Cleaning Technology for Silicon Wafers

In the preparation process of semiconductor materials, every single step involves cleaning, and the quality of cleaning directly affects the subsequent processes—and even impacts the yield and reliability of finished devices. Due to the rapid increase in ULSI integration density and the shrinking dimensions of devices, the requirements for wafer surface cleanliness have become even more stringent. ULSI processes demand that the substrate wafers provided should have no more than 500 particles/m² × 0.12 μm, and metal contamination must be less than 10¹⁰ atoms/cm². Any potential contamination present at each stage of wafer fabrication can lead to defect formation and device failure. Therefore, wafer cleaning has attracted considerable attention from industry professionals. Previously, many manufacturers relied on manual washing methods, which involved significant human intervention. On the one hand, this approach was prone to generating debris, thereby reducing economic efficiency; on the other hand, manually cleaned wafers often exhibited poor surface cleanliness and severe contamination, resulting in a lower pass rate during the subsequent chemical polishing and etching processes. Consequently, wafer cleaning technology has come under increased scrutiny, and finding a simple and effective cleaning method has become an urgent priority. A specialized technique—ultrasonic cleaning—has been introduced, demonstrating remarkable effectiveness in cleaning silicon wafers and thus representing a promising cleaning technology worthy of wider adoption.

On Ultrasonic Cleaning Technology for Silicon Wafers

12

2021-08

In 2019, China’s pure-play foundry sales grew by 6%, making it the only region globally to post positive growth.

Compared to 2017, China’s share of the pure-play foundry market grew by 5% in 2018, reaching 19%—five percentage points higher than that of other countries in the Asia-Pacific region. Overall, the growth of the pure-play foundry market in 2018 was largely driven by China. However, in 2019, the U.S.-China trade war slowed China’s economic growth, and China’s share of the pure-play foundry market increased by only one percentage point, reaching 20%. In 2018, China’s pure-play foundry sales surged by 42%, reaching US$10.7 billion—a figure more than eight times the 5% growth rate of the global pure-play foundry market that year. Moreover, in 2019, pure-play foundry sales to China rose by 6%, outpacing the overall pure-play foundry market’s 2% decline by eight percentage points. In 2019, TSMC, a pure-play foundry company headquartered in Taiwan, China, reported that about 25% of its more than 400 customers were located in mainland China. Both TSMC and UMC achieved double-digit growth in sales in China last year. UMC recorded the largest increase in sales in China, at 19%. This growth was driven by its 300mm Fab 12X wafer fab in Xiamen, China, which opened at the end of 2016 and currently has a capacity of approximately 22,700 300mm wafers per month. By contrast, many of SMIC’s Chinese customers appeared to be experiencing slow business growth. SMIC’s sales in China declined by 8% in 2019, while its total sales fell by 7%.

In 2019, China’s pure-play foundry sales grew by 6%, making it the only region globally to post positive growth.
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